| Egyptian Journal of Archeological and Restoration Studies


EJARS (Established 2011)

Volume 13 ,issue 1 | Winter and Spring 2023 | Pages : 61-74

RF-PLASMA PROTECTIVE COATING ON SILVER- COPPER ALLOYS USING HDMSO/O2/AR PRECURSORS

Document Type: Original Article

DOI: 10.21608/ejars.2023.305187

pages: 61-74

Authors:
Abd EL-Moaz, Y. 1 (*), Mohamed, W. 1 , Rifai, M. 1 , Morgan, N. 2 , 3 & Abdel Ghany, N. 4

1 Conservation dept., Faculty of Archaeology, Cairo Univ., Giza, Egypt
2 Plasma Center, Al-Azhar Univ., Cairo, Egypt.
3 Physics dept., Faculty of Science, Al-Azhar Univ., Cairo, Egypt.
4 Physical Chemistry dept., National Research Centre, Dokki, Cairo, Egypt

Abstract:
Due to its excellent adherence to the metal substrate, Hexamethy-ledisiloxan was employed in the present study to create transparent barrier coating films that protect metal artifacts from corrosion. The deposition procedure used radio frequency plasma enhanced chemical vapor deposition (RF-PECVD). Using scanning electron microscopy combined with energy dispersive X-ray (SEM-EDX) and Fourier-transform infrared spectroscopy (FT-IR), the surfaces of the deposited films were identified and characterized. Atomic force microscopy was used to examine surface topography and roughness (AFM). Water contact angle measurement was used to determine the hydrophobic property (WCA). Moreover, a spectro-scopic ellipsometer was used to measure the film's thickness (SE). Following the Siloxane protective layer's PECVD deposition, colori-metric measurement (CM) was utilized to assess surface appearance alterations. Electr-ochemical impedance spectroscopy (EIS) was used to study how siloxane coatings for metal substrates protect against corrosion as a function of RF power and gas input composition. It was found that the siloxane thin film's adhesion characteristics to the silver-copper alloy substrate were affected by the substrate pret-reatment process and the consumed power during the deposition process.

Keywords:
Plasma enhanced chemical vapor deposition(PECVD) Thin Films Adhesion Silicon dioxide Argon Ellipsometry

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